2 in 1 head Touch Screen BGA Rework Station
1. Product description of 2 in 1 head BGA rework station DH-A1L
Dinghua BGA Rework Station DH-A1L
This machine is for repairing motherboard IC/Chip/Chipset of laptops, Mobile, PC, iPhones, Xbox, etc. WithÂ
features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Laser Position,Â
Soldering Iron, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.
2. Product specification of 2 in 1 head bga rework station DH-A1L
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DH-A1LÂ Â Specification |
|
Product name |
soldering and desoldering machine |
Power |
4900W |
Top heater |
Hot air 800W |
Bottom heater |
Hot air 1200W, Infrared 2800W |
Iron heater |
90w |
Power supply |
AC220V±10% 50/60Hz |
Dimension |
640*730*580mm |
Positioning |
V-groove, PCB support can be adjusted in any direction  with an external universal fixture |
Temperature control |
K-type thermocouple, closed-loop control, independent  heating |
Temp accuracy |
±2 degrees |
PCB size |
Max 500*400 mm Min 22*22 mm |
BGA chip |
2*2-80*80mm |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
1(optional) |
Net weight |
45kg |
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3. Product advantages of 2 in 1 head bga rework station DH-A1L
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4. Product details of 2 in 1 head bga rework station DH-A1L
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5. Why Choose 2 in 1 head BGA rework station DH-A1L
â‘ Precise PID smart temp control, the No.1 key factor for the quality of the BGA Rework Station Temperature curve.
â‘¡Accurate rework only heats the chips where needed. All excess heat will reflow back to ensure the components
 around BGA will not be influenced.
â‘¢Heating doesn't influence the appearance of PCB even after using it several times.
6. Packing, and delivery of 2 in 1 head bga rework station DH-A1L
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7. Know something about BGAÂ
Light BGA package material
Optical BGA packaged shells are often made of ceramic materials. This rugged ceramic material has many advantages, such asÂ
design flexibility with micro design rules, simple process technology, high performance, and high reliability, generally by changingÂ
the physics of the shell The structure can be designed for optical BGA packages.
Ceramic materials also have airtightness and good primary reliability. This is due to the fact that the thermal diffusion coefficientÂ
of the ceramic material is very similar to the thermal diffusion coefficient of the GaAs device material. Moreover, since the ceramicÂ
material can be three-dimensionally wired with overlapping channels, the overall package size will be reduced.
In general, heat can be controlled when mounting optical devices because heat can deform the package. The final alignment of the opticalÂ
device with the optical fiber can also produce movement that will change the optical characteristics. With ceramic materials, thermalÂ
deformation is small. Therefore, ceramic materials are very suitable for optoelectronic component packaging and have a significantÂ
impact on the optical communications transmission network market.
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